Ship a smaller, cheaper, quieter, higher-power product.

Fermi helps hardware teams optimize thermal designs before late testing turns heat into a launch blocker.

Find the thermal constraint while the design is still changeable.

Built for teams optimizing:

enclosure size
fan noise
power density
cooling cost
thermal margin
Thermal Trade Study · High-power enclosure
Variants compared
Design question: Can this enclosure support higher power without adding another fan, increasing product volume, or discovering thermal failures during late validation?
01

Baseline the design

Start from current CAD, heat loads, fan assumptions, vents, materials, and operating envelope.

02

Find the bottleneck

Identify where heat is trapped, airflow is wasted, or margin is being consumed.

03

Compare options

Test venting, fan, heatsink, layout, material, and derating changes without rebuilding setup.

04

Pick the tradeoff

Quantify which design gives the best size, cost, noise, power, and margin balance.

Product target
Higher power
Evaluate whether the design can support more output inside the same thermal envelope.
Risk avoided
Late failure
Catch overheating, derating, fan dependence, and enclosure hotspots before physical validation.
Decision output
Tradeoff clarity
Smaller enclosure, lower BOM, lower noise, higher power, or more thermal margin.

Fermi turns thermal simulation into a product tradeoff workflow, not just a plot-generation exercise.

Use cases
Thermal performance is a product decision.

Size, cost, acoustic noise, power output, and reliability are coupled. A bigger enclosure may solve heat but hurt packaging. A faster fan may buy margin but create noise. A higher power target may pass in CAD and fail in thermal validation.

Fermi helps teams test those tradeoffs earlier, while mechanical, electrical, and product constraints are still negotiable.

Do not discover the thermal limit after the product shape, BOM, and launch date are already fixed. Use simulation early enough to decide what can get smaller, cheaper, quieter, or more powerful without giving back reliability.

Product proof
Make the workflow visible.

The best screenshots or GIFs should show the design loop: preparing a case, comparing variants, and turning physics output into a decision.

Screenshot / GIF 01

CAD cleanup

Show Fermi simplifying messy geometry and preserving thermal intent.

Screenshot / GIF 02

Variant comparison

Show fan, vent, heat sink, or enclosure options compared side by side.

Screenshot / GIF 03

Actionable result

Show the bottleneck, recommendation, and product tradeoff in one view.

What Fermi helps optimize
Turn thermal analysis into concrete product choices.

Smaller packaging

Check whether enclosure volume, vent area, heat sink size, or spacing can be reduced without losing margin.

Lower system cost

Compare cheaper fans, simpler heat sinks, thinner materials, and lower-cost layouts against thermal performance.

Quieter operation

Evaluate fan speed, airflow path, ducting, and passive cooling options before noise becomes a product issue.

Higher power density

Validate whether more output, tighter placement, or a broader operating envelope is thermally credible.

Workflow
From thermal uncertainty to a product tradeoff.

Start with one design question: smaller, cheaper, quieter, higher-power, or safer against field failures.

01

Submit the current case

Share CAD, mesh, heat loads, fan curves, materials, operating conditions, or prior results.

02

Reconstruct the baseline

Fermi prepares the model and establishes the current thermal bottleneck and margin.

03

Generate variants

Compare geometry, airflow, cooling, placement, power, and derating changes from reusable setup.

04

Rank the tradeoffs

See which options improve size, cost, noise, power, or margin, and which create unacceptable risk.

05

Carry the model forward

Reuse the workflow as the design changes instead of restarting simulation setup every time.

Why it matters
Late thermal discovery is expensive because it attacks finished decisions.
Late discoveryEarlier Fermi workflow
The enclosure is already tooledCompare packaging limits before committing geometry.
The fan is too loudEvaluate airflow and acoustic tradeoffs while fan strategy is still open.
The BOM is lockedTest lower-cost thermal paths before procurement hardens.
The product derates in validationFind the thermal constraint before launch readiness depends on it.

The value is not just faster simulation. It is preserving optionality while the product is still designable.

Best fit
Useful when the thermal question affects the product promise.

Power electronics

Increase output, reduce derating, or shrink the enclosure without creating hotspots.

Battery systems

Balance pack density, cooling strategy, operating envelope, and reliability.

EV charging and energy hardware

Validate high-power cabinets where uptime, ambient conditions, fan strategy, and serviceability interact.

Industrial and electromechanical systems

Reduce thermal risk in dense assemblies before late-stage testing forces mechanical changes.

The result
Better thermal decisions before the expensive part of hardware development.

Fermi helps teams use simulation when it can still change the product, not only when it can explain why the product failed.

The outcome is a tighter design loop: fewer late surprises, clearer tradeoffs, and more confidence in size, cost, noise, power, and reliability decisions.

A 30-minute working session
Get the rest of your day back.

Walk us through your geometry, and we'll schedule a working session around your actual validation criteria. If Fermi fits your use case, we'll proceed to a paid deployment with your team.

Step 1

Submit your use case.

Geometry or assembly files are optional. If the geometry is sensitive, request an NDA before review.

Best first pilots use one active enclosure, board, battery module, or cooling design with a concrete thermal decision.

Step 2

Book the working session.

Pick a time to confirm fit, inputs, constraints, and what the 14-day pilot should prove.